ADLINK Technology has just unveiled the LEC-MTK-I12000 SMARC 2.1 compliant System-on-Module (SoM), powered by the MediaTek Genio 1200 octa-core Cortex-A78/A55 AIoT processor paired with up to 8GB of RAM and 256 GB of UFS storage, as well as the I-Pi SMARC 1200 development kit designed for robotics and AIoT applications.
Specifications of the LEC-MTK-I1200 SoM:
- SoC – Octa-core MediaTek Genio 1200 (MT8395) processor with 4x Cortex-A78 cores at 2.2 GHz, 4x Cortex-A55 cores at 2.0 GHz with Arm Mali-G57 penta-core GPU at 880 MHz with support OpenGL ES 3.2/2.0/ 1.1, Vulkan 1.1/1.0, OpenCL 2.2, 4.8 TOPS NPU, HiFi 4 audio DSP, etc…
- System memory – 4 or 8 GB LPDDR4X
- Storage – 32, 64, 128 or 256 GB of UFS storage, compatible with UFS gear 2.1
- Wireless – 802.11b/g/n/ac Wi-Fi 5 2×2 MU-MIMO, Bluetooth 5.0
- 314-pin MXM connector with
- Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0
- Display
- HDMI 2.0b up to 4Kp60
- Dual channel LVDS
- 2x 4-way MIPI DSI up to 4Kp60 with 24-bit RGB
- Camera I/F – 3x 4-way MIPI CSI
- Audio – I2S for the audio codec located on the carrier board
- Networking – 2 Gigabit Ethernet RJ45 ports
- PCIe – 1x PCIe Gen 3 x2
- USB – 2x USB 3.0, 4x USB 2.0
- Serial – 4x UART, 1x CAN 2.0B bus up to 8Mbps
- Low-speed I/O – 2x SPI, 4x I2C, 14x GPIO with interrupts, one with PWM
- Security – Optional TPM 2.0 security module (optional)
- SEMA Card Controller – Voltage/Current Monitoring, Power Sequencing, Logistic/Forensic Information, I²C Bus Control, GPIO Control, Watchdog Timer
- Debugging
- General-purpose 30-pin ribbon cable connector for use with optional DB-30 debug module
- JTAG, BMC access
- UART, power test points
- Diagnostic LEDs, Power, Reset, Boot Configuration
- Supply voltage – 5V DC
- Dimensions – 82 x 50mm; SMARC 2.1 form factor
- Temperature Range – Standard: 0°C to 60°C; rugged: -40°C to 85°C
- Humidity
- 5 to 90% relative humidity operating, non-condensing
- Storage 5-95% RH (and operation with conformal coating)
- Shock and vibration – IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
- HALT – Thermal stress, vibration stress, thermal shock and combined test
ADLINK provides support for Ubuntu and Yocto Linux for the module. It offers specs that will outperform modules based on the much talked about Rockchip RK3588 processor, and the module is designed for AIoT applications with a 4.8 TOPS AI accelerator, supports up to 3 cameras and a relatively low power envelope suitable for robotics. and drone applications.
I-Pi SMARC 1200 Development Kit
I-Pi SMARC 1200 Development Board Specifications (Preliminary):
- SoM – LEC-MTK-I1200 SMARC Module with 4GB LPDDR4 Memory and 64GB UFS Storage
- Video output – HDMI 2.0b port up to 4Kp60
- Networking – 2 Gigabit Ethernet RJ45 ports
- USB – 2 USB 3.0 ports, 2 USB 2.0 ports
- Expansion – Multiple headers and connectors to expose SoM I/O
- Debug – Serial via MicroUSB port
- Power supply – 12V DC via power socket
The kit will come with the module with heatsink, the plinth, a micro USB cable and a 12V DC adapter plus a power cord. Some more details about the module and the SDK can be found on the product page and on the ipi.wiki website.
ADLINK told CNX Software that the dev kits should be available in August, but pricing hasn’t been set yet and may depend on supply chain issues, which are easing now, but we never know what that the future holds for us. The company will also showcase the solution at Embedded World 2022 next week.
Jean-Luc started CNX Software in 2010 on a part-time basis, before stepping down as Director of Software Engineering and starting writing daily news and reviews full-time later in 2011.
